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日本NEC公司以DVMulti、Neo Laminete和NeoSolde作为三大支柱技术,推动印刷电路板事业发展。 所谓DV Multi系指开始供应面向工作站WS和高档PC机的工艺新技术,例如,高速电路的多芯片模块(MCM)用基板,通过组合built-up工程方法,实现线条宽/线条间距精细化(70μm线条宽/70μm间距)的多层基板,通过Viahole或photovia方法钻出中Φ0.2mm的通孔。 所谓新压层板(Neo Lami-
NEC Corporation of Japan uses DVMulti, Neo Laminete and NeoSolde as three pillar technologies to promote the development of printed circuit board business. The so-called DV Multi refers to the introduction of new process technologies for workstations WS and high-end PCs, such as high-speed circuit multi-chip module (MCM) substrates. By combining built-up engineering methods, the line width/line spacing fineness is achieved ( A 70 μm line width/70 μm pitch multilayer substrate was drilled with via holes of φ0.2 mm through Viahole or photovia methods. New laminates (Neo Lami-