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从1971年世界诞生第一枚微处理器,到如今双核CPU的发布,短短30年的时间,芯片技术经历了翻天覆地的变化。毫无疑问,未来芯片和微处理器技术的三大主要技术:设计、生产和封装/测试,仍会以惊人的速度不断地发展.并将带来整个电子制造业的持续升温。当今电子产业发展的趋向是更趋于多功能、高集成、低能耗、便携带和小型化。作为芯片产业核心的微处理器技术,在过去几年,其应用范围正在快速
From 1971 the world’s first microprocessor was born to the present dual-core CPU release, just 30 years, chip technology has undergone enormous changes. There is no doubt that the three major technologies of future chip and microprocessor technology: design, manufacturing and packaging / testing will continue to evolve at an alarming rate and will continue to heat up the entire electronics manufacturing industry. The trend of the development of electronic industry today tends to be more multi-functional, highly integrated, low power consumption, portability and miniaturization. Microprocessor technology, which is at the core of the chip industry, has been rapidly expanding in the past few years