激光在半导体电子工业生产中已得到日益广泛的应用,这是激光微加工最集中、最重要的应用领域.所谓激光微加工,系指激光与被加工材料互作用区大小在亚毫米至亚微米并且互作用激光能量在毫焦耳范围内的加工.激光微加工的许多技术如激光微调、激光划片、激光标记、激光焊接等等已? Laser in the semiconductor electronics industry has been increasingly widely used, which is the most concentrated laser micro-machining the most important application areas.The so-called laser micro-machining, refers to the interaction between the laser and the processed material size in the sub-millimeter to sub-micron And interacts with laser energy processing in millijoules. Many techniques for laser micromachining, such as laser trimming, laser scribing, laser marking, laser welding,