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研究了时效温度、时间和冷变形后时效对Cu-Ni-Si-Cr-P合金微观组织和性能的影响。结果表明,合金经900℃固溶处理后,在500℃×2h时效时合金电导率和硬度(HV)分别达到21.87 MS/m和234.5。变形量为60%的Cu-Ni-SiCr-P合金经450℃×1h时效可获得良好的综合性能,其电导率达到20.07MS/m,硬度(HV)达到255.3。对Cu-Ni-Si-CrP合金450℃时效试样进行显微分析,发现了细小弥散的Ni2Si和Ni3P析出物。
The effects of aging temperature, time and aging after cold deformation on the microstructure and properties of Cu-Ni-Si-Cr-P alloy were studied. The results show that the electrical conductivity and hardness (HV) of the alloy reach 21.87 MS / m and 234.5 at 500 ℃ for 2h after solution treatment at 900 ℃. The Cu-Ni-SiCr-P alloy with deformation of 60% achieved good comprehensive properties after aging at 450 ℃ for 1h. The conductivity reached 20.07MS / m and the hardness (HV) reached 255.3. Microstructure analysis of Cu-Ni-Si-CrP alloy aged at 450 ℃ showed that finely dispersed Ni2Si and Ni3P precipitates were found.