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众所周知,印刷线路板不仅可以省去布线工序,而且对提高焊接质量也至关重要。目前一直沿用传统的三氯化铁腐制方法,由于这种方法存在着腐蚀速度慢、效率低、质量差等缺点,因此,人们一直在寻求新的腐制途径。最近我们作了一系列不同浓度的三酸(硝酸、硫酸、盐酸)和不同介质、不同条件下的多种实验,最后筛选出了一种较理想的工艺方法——盐酸过氧化氢法。以此法制板,在室温7℃条件下腐蚀9×5.6 cm的一块双面敷铜线路板,平均只需6 min,而旧法(三氯化铁)则需要48min,工效提高8倍,且新法腐制的线路板无渗透、无腐断、无毛刺、效果很好。这里简介如下:1.原理
As we all know, printed circuit board not only eliminates the wiring process, but also to improve the quality of welding is also crucial. At present, the traditional method of decarbonization of ferric chloride has been used. Because of its shortcomings of slow corrosion rate, low efficiency and poor quality, people always seek new ways of decay. Recently we made a series of different concentrations of triacid (nitric acid, sulfuric acid, hydrochloric acid) and different media, a variety of experiments under different conditions, and finally screened out a more ideal process - hydrochloric acid hydrogen peroxide. According to this method, a 9 × 5.6 cm double-sided copper-clad circuit board was etched under the condition of 7 ℃ at room temperature for an average of 6 minutes, while the old method (ferric chloride) required 48 minutes and the work efficiency increased by 8 times. Corrupted circuit board no penetration, no corruption, no glitches, the effect is very good. Here is a brief introduction: 1. Principle