论文部分内容阅读
在Gleeble-3500热模拟机上进行了等温压缩热模拟试验,研究了T2紫铜在低温塑性变形中流变应力行为和不同变形条件以及退火对组织和性能的影响。结果表明:T2紫铜在25~225℃、应变速率0.01~1s-1时,真应力—真应变曲线为动态回复型;应变速率为10 s-1时为动态再结晶型。变形温度越高,流变应力峰值越低;应变速率越高,达到流变应力峰值的速度就越慢,此过程存在明显的动态软化。变形试样经200℃×2 h退火处理后,硬度明显降低,部分晶粒被等轴状晶取代,组织更均匀。
The isothermal compression heat simulation experiment was carried out on the Gleeble-3500 thermal simulator to study the flow stress behavior and different deformation conditions of T2 copper at low temperature plastic deformation and the effect of annealing on microstructure and properties. The results show that true stress-true strain curve of T2 red copper is dynamic recovery type at 25-225 ℃ and strain rate of 0.01-1s-1, and dynamic recrystallization at strain rate of 10 s-1. The higher the deformation temperature, the lower the peak flow stress; the higher the strain rate, the slower the peak flow stress, the process of dynamic softening obvious. After deformation of the sample annealed at 200 ℃ for 2 h, the hardness decreased obviously, some grains were replaced by equiaxed grains, and the structure was more uniform.