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利用扫描电子显微镜(SEM)和透射电子显微镜(TEM)研究了Sn3.8Ag0.7Cu(Sn37Pb)/Cu焊点在时效过程中的界面金属间化合物(IMC)形貌和成份。结果表明:150℃高温时效50、100、200、500h后,Sn3.8Ag0.7Cu(Sn37Pb)/Cu焊点界面IMC尺寸和厚度增加明显,IMC颗粒间的沟槽越来越小。50h时效后界面出现双层IMC结构,靠近焊料的上层为Cu6Sn5,邻近基板的下层为Cu3Sn。之后利用透射电镜观察了Sn37Pb/Ni和Sn3.8Ag0.7Cu/Ni样品焊点界面,结果显示,焊点界面清晰,IMC晶粒明显。
The interfacial intermetallic compound (IMC) morphology and composition of Sn3.8Ag0.7Cu (Sn37Pb) / Cu solder joints during aging were investigated by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The results show that the size and thickness of IMC at Sn3.8Ag0.7Cu (Sn37Pb) / Cu interface are obviously increased after aging at 150 ℃ for 50, 100, 200 and 500 hours, and the grooves between IMC particles are getting smaller and smaller. After 50h aging, a double-layer IMC structure appears, the upper layer near the solder is Cu6Sn5, and the lower layer adjacent to the substrate is Cu3Sn. After that, the solder joints of Sn37Pb / Ni and Sn3.8Ag0.7Cu / Ni samples were observed by transmission electron microscope. The results showed that the solder joint interface was clear and the IMC grains were obvious.