针对常用不同孔间距和形状组合的硅通孔(TSV)叠层封装的热问题,利用有限元软件建立模型,对多热源硅通孔叠层封装进行热循环瞬态分析。基于以上分析,进一步探讨不同孔间距和形状的封装体热应力分布情况,得出孔间距和形状与热应力之间的对应关系。数值算例结果表明,以孔间距为1mm朝下开口梯形圆台模型具有良好的热应力特性。 In order to solve the thermal problem of TSV stacks with different hole spacings and shape combinations, finite element software was used to establish a model to simulate the thermal cycle of TSV stacks. Based on the above analysis, the thermal stress distribution of packages with different hole spacings and shapes is further explored, and the corresponding relationship between the hole spacing and shape and thermal stress is obtained. The numerical results show that the trapezoidal frustum model with downward opening of 1mm in hole spacing has good thermal stress characteristics.