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世界一些主要电子封装厂商目前正在联合起来,支持一项有关叠层式多芯片封装(MCP)存储器产品的全行业标准。1999年10月,AMD、三磁等五大企业宣布将与富士通、NEC及东芝公司联合行动支持这项标准。 MCM这类多芯片封装产品现在
Some of the world’s major electronics packaging vendors are currently united to support an industry-wide standard for stacked multi-chip package (MCP) memory products. In October 1999, five major companies such as AMD and Trimagnetic announced their joint efforts with Fujitsu, NEC and Toshiba to support this standard. Multi-Chip Package Products Such as MCM Now