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为解决导电胶粘接元件接触电阻不稳定的问题,研究了在温度及压力应力条件下,导电胶在不同界面的导电性和体电阻率的变化情况,分析了导电胶接触电阻不稳定的机理。试验结果表明,导电胶粘接片式元件的接触电阻的稳定性不仅与工艺加工过程有关,而且与元件端头金属基材表面金属化层的电极电动势密切相关;采用Ag基或Au基端头元件时,其导电胶粘接元件的接触电阻在粘接装配工艺过程中是最稳定的。
In order to solve the problem that the contact resistance of the conductive adhesive is unstable, the change of the electrical conductivity and the volume resistivity of the conductive adhesive at different interfaces under the conditions of temperature and pressure stress is studied. The mechanism of the contact resistance instability of the conductive adhesive is analyzed . The experimental results show that the stability of the contact resistance of the conductive adhesive chip components is not only related to the process of the process, but also closely related to the electrode electromotive force of the metallization layer on the surface of the metal tip of the component end. The Ag-based or Au- When the component, the contact resistance of the conductive adhesive bonding component is the most stable during the bonding assembly process.