一、前言目前,国内外电子元器件引线应用最为广泛的是在铜基引线或CP线(低碳钢线上镀上铜层)上,运用电镀法或热浸法,在引线表面镀(涂)上一定厚度的纯锡或铅锡合金,使元器件引线具有良好的软钎焊性。由于电子元器件在制造过程中受到工艺和操作条件的影响,以及制成后,受贮存条件、运输和保存时间长短的影响,常常会导致引线的软钎焊性下降,从而降低了焊接质量,影响整机产品的性能。引线软钎焊性降低的原因,普遍认为是铜锡 I. Introduction At present, the most widely used lead wire of electronic components at home and abroad is copper plating or CP plating (copper plating on mild steel), electroplating or hot-dip coating on the lead surface ) On a certain thickness of pure tin or pewter, the component leads have good solderability. As the electronic components in the manufacturing process by the process and operating conditions, as well as made, subject to storage conditions, transportation and preservation of the length of the impact of the lead will often lead to reduced solderability, thus reducing the welding quality, Affect the performance of the whole product. The reason for the reduced solderability of leads is generally considered as copper tin