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在半导体器件的生产中,一般采用的银浆烧结具有工艺简便、效率高、成本低等优点.但Vces易变问题一直是银浆烧结得不到广泛推广的原因.金镓、金锑、铅锡等烧结工艺虽在解决Vces稳定性方面收到了良好的效果.但成本高、效率低、不适于批量生产,因此其应用上也受到一定限制.因此,需要一种新的烧结材料来解决小功率管烧结的高效率、低成本和Vces稳定性的问题.我厂通过近年来的生产实践与质量考核、导电胶烧结工艺取得了比较满意的结果,现将我们的工作情况简介如下:
In the production of semiconductor devices, the commonly used silver paste sintering has the advantages of simple process, high efficiency, low cost, etc. However, the Vces variable problem has been the reason why the silver paste sintering has not been widely promoted.Gallium gallium, gold antimony, lead Although the sintering process of tin and other good results in the stability of Vces received, but the high cost, low efficiency, not suitable for mass production, so its application is subject to certain restrictions.Therefore, the need for a new sintered material to solve small Power tube sintering of high efficiency, low cost and Vces stability problems. Our factory in recent years through the production practice and quality assessment, conductive adhesive sintering process has been more satisfactory results, and now our work profile is as follows: