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掺铒光纤放大器(EDFA)中的掺铒光纤通常具有较小的模场直径(约4～6μm).如果将这些光纤随意地与大模场直径(7.5～10.5μm)色散位移光纤或一般的光纤相拼接,则会引起大的传输损耗.然而,由于大多数掺铒光纤结构的扩散速度大于其它光纤,为了确保纤芯掺杂剂的最佳热扩散,我们在成像工艺和同步拼接评估法的基础上,开发了专用实时控制(RTC)拼接技术,以在匹配光纤间产生锥形传输区,形成始终如一的低损耗(<0.1dB)和高强度(>1379MPa)的光纤拼接.
Erbium-doped optical fibers in an erbium-doped fiber amplifier (EDFA) typically have a small mode field diameter (about 4 to 6 μm). If these fibers are optionally dispersed with a large mode field diameter (7.5 to 10.5 μm) However, since most erbium-doped fiber structures diffuse faster than other fibers, in order to ensure optimal thermal diffusion of the core dopant, we conducted a series of experiments on the imaging process and the simultaneous splicing evaluation , A dedicated real-time control (RTC) splicing technology has been developed to create a conical transmission zone between the matched fibers to create consistently low-loss (<0.1dB) and high-intensity (> 1379MPa) fiber splices.