论文部分内容阅读
研究添加微量单一Ni、P或稀土Ce元素对Sn3.0Ag0.5Cu(质量分数,%)无铅钎料熔化温度、润湿性能、时效前后钎焊接头的剪切强度和显微组织的影响。结果表明:单一Ni、P和稀土Ce元素的添加,对Sn3.0Ag0.5Cu钎料合金的熔化温度影响很小;P元素的加入能够增大合金的润湿力,缩小润湿时间。加入单一的Ni或稀土Ce元素对合金的润湿性能和接头时效前的剪切强度影响不大,但能够很好地抑制高温时效引起的接头剪切强度的下降。此外,P元素的添加明显地改善了合金的抗氧化性能,但稀土Ce元素的添加对其有所恶化。这些性能的改变与微量Ni、P或稀土Ce元素对其显微组织的影响有关。
The effects of adding single Ni, P or rare earth element Ce on the melting temperature and wettability of Sn3.0Ag0.5Cu (mass fraction) lead-free solder and the shear strength and microstructure of the brazed joints before and after aging were investigated. The results show that the addition of a single element of Ni, P and rare earth Ce has little effect on the melting temperature of Sn3.0Ag0.5Cu solder alloy. The addition of P element can increase the wetting ability of the alloy and reduce the wetting time. The addition of single Ni or rare earth Ce has little effect on the wettability of the alloy and the shear strength before the joint aging, but it can restrain the decline of the joint shear strength caused by the high temperature aging. In addition, the addition of P element obviously improved the oxidation resistance of the alloy, but the addition of rare earth element Ce deteriorated it. These properties are related to the effect of trace Ni, P or rare earth Ce on their microstructure.