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利用正交试验设计、可焊性测试仪测定润湿力的方法，探讨了电子元器件引线上６０焊锡镀层中的微量元素Ｂｉ和Ｓｂ及热浸镀温度对可焊性的影响。方差分析表明，Ｂｉ与Ｓｂ二元素的交互作用对焊锡润湿性能的影响高度显著；微量元素Ｂｉ对焊锡润湿性能影响显著。用正交多项式回归分析，得出了Ｂｉ和Ｓｂ的含量、热浸镀温度与焊锡可焊性间的关系式，用此关系式可对焊锡可焊性进行评价及预测。由试验还得到了Ｂｉ和Ｓｂ的含量及热浸镀温度的优化组合条件。
The orthogonal test design was used to determine the wettability of solderability tester. The effects of trace elements Bi and Sb and the hot dip temperature on the solderability of 60 solders on the leads of electronic components were discussed. Variance analysis showed that the interaction between Bi and Sb was highly significant on the wettability of solders. Trace element Bi had a significant effect on the wettability of solders. By orthogonal polynomial regression analysis, the relationship between the content of Bi and Sb, the hot dip temperature and the solderability of solders was obtained. The solderability of solder can be evaluated and predicted by this relationship. From the experiment, the optimal combination conditions of the contents of Bi and Sb and the hot-dip temperature were also obtained.