一、前言 离子镀膜是继蒸发和溅射而发展起来的新技术,尤其是空心阴极离子镀(简称HCD法)在国内引起了各行各业广泛的关注和重视,正处在大力研究和发展之中。它是一种在低压强下产生的等离子电子束作为热源,将欲蒸镀的材料熔化为蒸汽,同时通入反应气体,在特定的条件下离化并活化 I. Introduction Ion plating is a new technology developed after evaporation and sputtering. Especially hollow cathode ion plating (referred to as HCD method) has aroused widespread concern and attention from all walks of life in China and is under vigorous research and development in. It is a low-pressure plasma electron beam generated as a heat source, the material to be evaporated into a vapor melting, while the introduction of the reaction gas, under certain conditions, ionization and activation