论文部分内容阅读
目前,MULTIBUS~(TM)Ⅱ已成为硅片的使用做好了准备。Intel公司公布两种VLSI器件的技术规格。该器件将加速我们的设计时代,并致使所必需的总线接口空间减小百分之七十。
Currently, MULTIBUS ~ (TM) Ⅱ has become ready for the use of silicon. Intel Corporation announced two VLSI device specifications. The device will speed up our design time and reduce the required bus interface space by 70%.