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众所周知,半导体器件外壳如果没有一个高质量的封装,器件的性能就得不到充分的发挥,也不能可靠的工作。在微波器件的生产中,采用金属陶瓷同轴型管壳的封装工艺,封装的气密性对微波电性能亦很重要。微波管壳制备工艺包括瓷件制备、研磨、清洁、涂胶、陶瓷金属化、镀镍、装舟、烧焊、粗检、镀金、探漏等过程。影响气密性的主要是瓷件制备、金属化及烧焊工艺。为保证管壳有良好气密性,漏孔的漏率应小于1×10~(-7)托升/秒。
As we all know, the semiconductor device shell without a high-quality package, the device’s performance will not be fully played, it can not be reliably work. In the production of microwave devices, the use of metal-ceramic coaxial package process shell, the air tightness of the package is also very important for microwave electrical properties. Microwave tube shell preparation process includes porcelain preparation, grinding, cleaning, coating, ceramic metallization, nickel plating, loading boat, welding, rough inspection, gold plating, leakage detection and other processes. Affect the airtightness is mainly ceramic preparation, metallization and welding process. In order to ensure the tube shell has a good air tightness, leakage rate of leakage should be less than 1 × 10 ~ (-7) lift / sec.