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采用统一型粘塑性Ａｎａｎｄ模型描述ＳｎＰｂ针料的非弹性力学行为，基于试验数据和弹塑性蠕变本构模型，确定了９２．５Ｐｂ５Ｓｎ２．５Ａｇ和６０Ｓｎ４０Ｐｂ两种钎料Ａｎａｎｄ模型的材料参数。采用线性粘弹性Ｍａｘｗｅｌｌ模型，描述了一种倒装焊底充胶Ｕ８３４７－３材料的模量松弛和体积松弛，得到了相应的松弛参数，研究对所给出的材料模型和参数进行了验证。另外，利用有限元法模拟了倒装焊在热循环条件下的应力应变行为，分析了ＳｎＰｂ焊点的塑性应变和热循环寿命。结果表明，采用上述材料模型和参数，可以合理描述ＳｎＰｂ钎料和底充胶的力学本构，并可应用于电子封装的可靠性模拟和分析。
The uniform viscoplastic Anand model was used to describe the inelastic mechanical behavior of SnPb stitches. Based on the experimental data and elastoplastic creep constitutive model, the material parameters of the Anand model of 92.5Pb5Sn2.5Ag and 60Sn40Pb brazing alloys were determined. A linear viscoelastic Maxwell model is used to describe the modulus relaxation and volume relaxation of a flip-chip underfill U8347-3 material. Corresponding relaxation parameters are obtained. The material model and parameters are validated. In addition, the stress-strain behavior of flip-chip bonding under thermal cycling was simulated by finite element method. The plastic strain and thermal cycle life of SnPb solder joints were analyzed. The results show that using the above material models and parameters, the mechanical constitutive of SnPb filler metal and underfill can be reasonably described, and can be applied to the reliability simulation and analysis of electronic package.