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以双马来酰亚胺(BMI)、双酚A型氰酸酯(BADCy)和苯并噁嗪(BOZ)树脂为基体树脂,纳米二氧化硅(nano-SiO2)为填料,制备耐高温胶粘剂。采用非等温差示扫描量热(DSC)法、Kissinger法和Ozawa法研究了nano-SiO2/BOZ/BMI/BADCy共聚物的固化动力学过程。结果表明:当m(BOZ)∶m(BMI)∶m(BADCy)=1∶1∶2、w(nano-SiO2)=3%时,相应BOZ/BMI/BADCy胶粘剂的表观活化能(47.82 kJ/mol)低于无nano-SiO2体系(59.17 kJ/mol),并具有良好的耐高温性能;在250℃时用该胶粘剂胶接硅钢片,胶接件经250℃老化1 000 h后,其剪切强度仍保持稳定。
BMI, BADCy and BOZ resin were used as matrix resin and nano-SiO2 as filler to prepare high temperature resistant adhesive . The curing kinetics of nano-SiO2 / BOZ / BMI / BADCy copolymers was investigated by non-isothermal differential scanning calorimetry (DSC), Kissinger method and Ozawa method. The results showed that the apparent activation energy of the corresponding BOZ / BMI / BADCy adhesive was 47.82 (m / s) when m (BOZ): m (BMI): m (BADCy) = 1: kJ / mol) was lower than that of the non-nano-SiO2 system (59.17 kJ / mol) and had good high temperature resistance. When the adhesive was used to bond the silicon steel sheet at 250 ℃ for 1 000 h, Its shear strength remains stable.