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马来酸对次磷酸钠化学镀铜沉积行为的影响研究了以次磷酸钠作还原剂,柠檬酸钠为配位剂的化学镀铜体系中,添加剂马来酸对镀层成分、结
Effect of Maleic Acid on Electroless Copper Plating Behavior of Sodium Hypophosphite In the electroless copper plating system containing sodium hypophosphite as a reducing agent and sodium citrate as complexing agent,