一、绪言近年来,对树脂包封的电子元件提出了能在苛刻的环境条件下使用和长期可靠地工作的要求,尤其是对汽车工业用的电子元件进一步提出了能充分满足冷热循环的环境要求。以往,电子元件包封用的材料主要是环氧树脂。这种树脂作为包封材料有许多优点,但在冷热循环条件下使用尚存在一些问 I. INTRODUCTION In recent years, resin-encapsulated electronic components have been put forward to be used under harsh environmental conditions and long-term and reliable work requirements. In particular, the electronic components for automotive industry are further proposed to fully meet the hot and cold cycle Environmental requirements. In the past, the encapsulation of electronic components is mainly epoxy resin. There are many advantages to using this resin as encapsulant, but there are still some questions