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1.贴片元器件贴装工艺表面贴装工艺集合了窄间距技术(FPT)、计算机集成制造系统(CIMS)、焊接技术等。贴片元器件贴装工艺不同,则SMT电路板有着不同的组装工艺流程,具体的一些表面贴装工艺见表1所示。技能·技巧:采用表面贴装技术的方式采用表面贴装技术的方式有以下两种:(1)完全表面安装同一块印制电路板上所需安装的元器件全部采用贴片元器件,没有采用通孔插装元器件。(2)混合安装
1. SMD components placement process Surface-mount technology combines a narrow pitch technology (FPT), Computer Integrated Manufacturing System (CIMS), welding technology. SMT components placement process is different, the SMT circuit board has a different assembly process, the specific surface mount technology shown in Table 1. Skills and skills: The use of surface mount technology The use of surface mount technology in the following two ways: (1) Completely surface mount on the same piece of printed circuit board required to install all the components using SMD components, there is no Through-hole plug-in components. (2) mixed installation