In this work we report the facile fabrication and performance evaluation of flexible heat pipes that have integrated bioinspired wick structures and flexible polyurethane polymer connector design between the copper condenser and evaporator. Inside the heat pipe, a bioinspired superhydrophilic strong-base-oxidized copper mesh with multi-scale micro/nano-structures was used as the wicking material and deionized water was selected as working fluid. Thermal resistances of the fabricated flexible heat pipes charged with different filling ratios were measured under thermal power inputs ranging from 2 W to 12 W while the device was bent at different angles. The fabricated heat pipes with a 30% filling ratio demonstrated a low thermal resistance less than 0.01 K/W. Compared with the vertically oriented straight heat pipes, bending from 30° up to 120° has negligible influence on the heat-transfer performance. Furthermore, repeated heating tests indicated that the fabricated flexible heat pipes have consistent and reliable heat-transfer performance, thus would have important applications for advanced thermal management in three dimensional and flexible electronic devices. In this work we report the facile fabrication and performance evaluation of flexible heat pipes that have integrated bioinspired wick structures and flexible polyurethane polymer connector design between the copper condenser and evaporator. Inside the heat pipe, a bioinspired superhydrophilic strong-base-oxidized copper mesh with Multi-scale micro / nano-structures was used as the wicking material and deionized water was selected as working fluid. Thermal resistances of the fabricated flexible heat pipes charged with different filling ratios were measured under thermal power inputs ranging from 2 W to 12 W while the device was bent at different angles. The fabricated heat pipes with a 30% filling ratio demonstrated low thermal resistance less than 0.01 K / W. Compared with the vertically oriented straight heat pipes, bending from 30 ° up to 120 ° with negligible influence on the heat-transfer performance. Furthermore, repeated heating tests indicated that the fabricated flexible heat pipe s have consistent and reliable heat-transfer performance, thus would have important applications for advanced thermal management in three dimensional and flexible electronic devices.