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表面组装焊点的几何形态是影响焊点可靠性的重要因素之一。本文采用有限元方法,重点讨论了润湿角对低银Sn2.5Ag0.7CuRE焊点的应力应变分布和热疲劳寿命的影响,并与Sn37Pb和Sn3.8Ag0.7Cu钎料焊点的热疲劳寿命进行了对比分析。研究表明,片式元件的理想接头形态为微凹形;在此形态下,与Sn37Pb和Sn3.8Ag0.7Cu钎料焊点相比,低银Sn-2.5Ag-0.7CuRE钎料的表面贴装元件焊点具有更高的热疲劳寿命。这一结果对于焊点的优化设计及新型无铅钎料的研制具有一定的指导意义。
Surface assembly of solder joint geometry is one of the important factors affecting the reliability of solder joints. In this paper, the influence of wetting angle on stress-strain distribution and thermal fatigue life of low-silver Sn2.5Ag0.7CuRE solder joint is discussed in detail. The thermal fatigue life of Sn37Pb and Sn3.8Ag0.7Cu solder joints Conducted a comparative analysis. The results show that the ideal shape of the chip component is a micro-concave shape. In this form, compared with Sn37Pb and Sn3.8Ag0.7Cu solder joints, the low silver Sn-2.5Ag-0.7CuRE solder surface mount Component solder joints have a higher thermal fatigue life. This result is of guiding significance for the optimal design of solder joints and the development of new lead-free solder.