为大大发展我国的电子工业,迅速赶上世界先进水平,半导体集成电路制造正在采用塑料包装这项新工艺。而内引线焊接强度则成为提高产品质量和包装成品率的关键问题之一。目前,国内各厂多倾向于采用焊接强度较高的超声波压焊。但由于外引线框结构的特殊性,即引线脚细长且多,在焊接的超声波能量损失较大,往往造成虚焊甚至焊不上。因此,必须借助于一种专用的辅助夹具,以保证超声压焊有良好的可靠性和较高的焊接强度。 For the great development of China's electronics industry, quickly catch up with the world's advanced level, the semiconductor integrated circuit manufacturing is using plastic packaging of this new technology. The inner lead welding strength has become one of the key issues to improve product quality and packaging yield. At present, the domestic factories tend to use a higher welding strength ultrasonic welding. However, due to the particularity of the structure of the outer lead frame, that is, the lead legs are slender and numerous, the energy loss of the ultrasonic wave in the welding is relatively large, which often results in that the solder joints are not soldered. Therefore, we must rely on a special auxiliary fixture to ensure ultrasonic welding with good reliability and high welding strength.