随着航天事业的发展,要求箭载电子设备在保障战术技术要求的前提下,设备的体积应尽最减小,重量也应减轻。虽然电子工业开发了功耗小的中规模、大规模以及二次集成电路,但设备功耗的减少与体积减小并不成正比,往往是体积减小很多,而功耗减小不大,这样就使设备的热密度大大地提高,设备内部温度也随之升高,可靠性降低。本文旨在讨论可靠性设计问题。 With the development of the aerospace industry, it is required that the electronic equipment loaded on the arrow should, under the premise of ensuring the technical requirements of the tactics, minimize the volume of the equipment and reduce the weight. Although the electronics industry has developed medium-sized, large-scale and secondary integrated circuits with low power consumption, the reduction in power consumption of the device is not proportional to the volume reduction, and often the volume is reduced a lot and the power consumption is not reduced so much The heat density of the device is greatly increased, the internal temperature of the device also increases, and the reliability is reduced. This article aims to discuss reliability design issues.