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本文介绍了一种全湿法、高活性的光刻胶去除溶剂,可以去除注入硬化的光刻胶,并具备对金属的兼容能力。在技术发展到45nm节点之后,
This article describes a fully wet, highly reactive resist removal solvent that removes the injected resist and has compatibility with metals. After the technology has been developed to a 45nm node,