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以普通核桃(Juglans regiaL.)、核桃楸(J.mandshurica Maxim.)、河北核桃(J.hopeiensis Hu)和黑核桃(J.nigra L.)4种核桃属植物的20份种质展叶期叶片为试验材料,采用电导法并配合Logistic方程确定其低温半致死温度(LT50);分析了LT50与叶片解剖结构之间的相关性。结果表明,随着处理温度的降低,核桃叶片的相对电导率(REC)均呈上升趋势;供试核桃种质间的抗寒性差异较大,低温半致死温度在–8～2℃之间,在黑核桃、核桃楸及普通核桃中均有抗寒性强的种质资源。利用略高于大部分核桃种质LT50的温度(0℃或–3℃)处理叶片,其相对电导率与低温半致死温度之间达到极显著正相关,而且相关系数高,此温度下处理12h后叶片的相对电导率以及叶片的LT50均可作为鉴定展叶期核桃种质抗寒性强弱的物理指标。核桃属不同种间的叶片结构类似,但各有特点。栅栏组织厚度和叶片总厚度与其LT50之间均达到极显著负相关,可作为核桃叶片抗寒性鉴定的形态结构指标。
Twenty germplasms from four species of Juglans of Juglans regia L., J.mandshurica Maxim., J. hopeiensis Hu and J. nigra L. were obtained. The leaves were used as test materials, and the LT50 was determined by the conductance method and logistic equation. The correlation between LT50 and leaf anatomy was analyzed. The results showed that with the decrease of treatment temperature, the relative conductivity (REC) of walnut leaves showed an upward trend. The cold tolerance of the walnut germplasm was significantly different, and the lethal temperature was between -8 ℃ and -2 ℃ , In the black walnut, walnut and common walnut cold hardiness germplasm resources. The leaves were treated with slightly higher temperature (0 ℃ or -3 ℃) than most walnut germplasm LT50, and the relative conductivity was very significantly positively correlated with the lethal temperature at low temperature, and the correlation coefficient was high at this temperature for 12h The relative electrical conductivity of the posterior leaf and the LT50 of the leaf can be used as physical indexes to identify the cold resistance of the walnut germplasm in the leaf-setting stage. Walnut different species of leaves similar in structure, but each has its own characteristics. The palisade tissue thickness and the total thickness of the leaves had extremely significant negative correlation with their LT50, which could be used as the morphological structure index of walnut leaf cold resistance identification.