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铜丝球焊由于其经济优势和优越的电气性能近来得到了普及,然而,在引线键合工艺中用铜丝取代金丝面临着一些技术上的挑战。多年来,IC芯片焊盘结构已经逐步适应了金丝球焊。铜在本质上比金硬度高,因此以铜线取代金线便引出了有关硬度的问题。研究了用25.4μm铜丝球焊中与键合机参数有关的铜焊球硬度特性。采用电子打火系统不同的电流和打火时间设置,用5%氢气和95%氮气组成的惰性保护气体形成了一个典型的25.4μm大小的铜焊球,研究了维氏硬度的焊球。用实验设计建立了第一和第二键合参数,进行了无空气焊球基本数据调整。通过改变电子打火系统参数,对硬度特性进行了进一步的测试。典型的键合球的大小和厚度的第一键合响应证实铜键合球的生产实力与电子打火系统的电流和打火时间有关。
Copper wire ball welding has recently gained popularity due to its economic advantages and superior electrical properties. However, replacing wire with copper wire in wire bonding processes presents some technical challenges. Over the years, IC chip pad structure has gradually adapted to the gold wire ball welding. Copper is inherently harder than gold, so replacing the gold wire with copper leads to the problem of hardness. The hardness characteristics of brazed balls related to the bonding machine parameters in 25.4μm copper wire ball welding were studied. Using different current and spark time settings of the electronic ignition system, a typical 25.4μm copper brazing ball was formed with inert shielding gas consisting of 5% hydrogen and 95% nitrogen. Vickers hardness solder balls were investigated. The experimental design was used to establish the first and second bonding parameters and the airless solder ball basic data was adjusted. The hardness characteristics were further tested by changing the parameters of the electronic ignition system. The first bond response of typical bond ball size and thickness demonstrates that the production capacity of copper bonded balls is related to the current and spark time of the electronic ignition system.