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电子信息产业的高速发展,使得电子装置或装备在使用过程中产生的热量越来越剧烈,需要及时导出以保证其正常运行,聚合物基导热复合材料由于其优异的加工性和较低的成本得到了应用。六方氮化硼(hBN)兼具优异的导热性和绝缘性,因此作为导热填料在导热绝缘聚合物复合材料领域受到越来越多的关注。本文主要从氮化硼填料尺寸、表面性质、取向结构以及杂化等方面综述了近年来氮化硼/聚合物导热复合材料的研究进展。
The rapid development of electronic information industry, making the electronic device or equipment in the use of heat generated more and more intense, need to be exported in time to ensure its normal operation, polymer-based thermal composites due to its excellent processability and lower costs Has been applied. Hexagonal boron nitride (hBN) has both excellent thermal conductivity and insulating properties, so it is attracting more and more attentions as a heat conductive filler in the field of heat conductive and insulating polymer composite materials. In this paper, the research progress of boron nitride / polymer thermal conductive composites in recent years is reviewed in terms of boron nitride filler size, surface properties, orientation structure and hybridization.