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本文着重研究非晶态Ｎｉ－Ｐ和Ｎｉ－Ｗ－Ｐ双层组合镀层的化学镀工艺条件：如镀液组分及ｐＨ值等对镀层成分、镀层沉积速率的影响。实验结果表明：在苹果酸体系中化学镀镍磷镀层比较合适的艺条件为：硫酸镍０．１ｍｏｌ／ｌ，次磷酸钠０．２５ｍｏｌ／ｌ，苹果酸０．２０ｍｏｌ／ｌ，琥珀酸０．１５ｍｏｌ／ｌ，ｐＨ＝４．５～５．０，温度为９０℃。化学镀镍钨磷镀层比例适合的工艺条件为：硫酸镍０．１ｍｏｌ／ｌ，钨酸钠０．１５ｍｏｌ／ｌ，次磷酸钠０．１ｍｏｌ／ｌ，柠檬酸钠０．１５ｍｏｌ／ｌ，ｐＨ＝８～９，温度为９０℃。
This article focuses on the amorphous Ni-P and Ni-W-P double-layer combination plating electroless plating process conditions: such as bath components and pH value of the coating composition, coating deposition rate. The experimental results show that the optimum conditions for the electroless Ni - P coating in the malate system are: 0.1 mol / L nickel sulfate, 0.25 mol / L sodium hypophosphite, 0.20 mol / L malic acid and 0 succinic acid. 15mol / l, pH = 4.5 ~ 5.0, the temperature is 90 ℃. Electroless nickel-tungsten-phosphorus plating ratio The suitable process conditions are as follows: nickel sulfate 0.1 mol / l, sodium tungstate 0.15 mol / l, sodium hypophosphite 0.1 mol / l, sodium citrate 0.15 mol / l, pH = 8 ~ 9, the temperature is 90 ℃.