电子爱好者在制作印刷电路板时大多采用三氯化铁溶液腐蚀。其缺点是:腐蚀速度不够快,且不易控制;使用次数有限,有些地方还不易买到。本文介绍用电镀原理腐蚀电路板的方法,解决了以上的不足。大家知道:电镀时,电镀池中阳极金属在电流作用下不断溶解,而镀到阴极的镀件上。因此,如果把电路板中需腐蚀的部分作为阳极(需腐 Electronic enthusiasts in the production of printed circuit boards are often used ferric chloride solution corrosion. The disadvantage is: corrosion speed is not fast enough, and not easy to control; the use of a limited number of times, some places are not easy to buy. This article describes the use of plating principle corrosion circuit board, to solve the above deficiencies. We all know: electroplating, the anode in the plating bath in the current role of the ongoing dissolution, and plated to the cathode plating. Therefore, if the circuit board to be corroded as an anode (need to rot