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高分子倒装芯片(PFC)工艺作为一种新兴的、更经济的以及更为先进的芯片装配的方法及某些应用已发表。另外,应用于智能卡和PCMCIA卡的倒装芯片安装技术也已被公开。本文的焦点话题是使用EPOTEK的高分子倒装芯片工艺技术装配的智能卡/IC微电子模块耐受高热和环境磨砺的可靠性。。所选取的测试样本均为4K系列EPROM器件,都是按照ISO7816-1,2或ISO7810的要求和标准进行装配并测试的。可靠性测试项目包括:-35C/24小时的低温存储,125C/48小时的高温存储,-30C到70C冷热循环10次,85C/85%RH恒温/恒湿存储96小时;测试项目还包括:96小时的盐雾环境存储和ESD敏感度测试(MS3015-4KV)。最后进行的测试是135C烘烤1000小时后各项性能数据的保持力。在个人电脑界面上植入一种智能卡读取器,用于运行一个诊断软件程序。一种可重复利用的卡片固定器被用于在诊断测试过程中临时固定那些装配好的内存芯片模块。这种软件程序被设计为分别在芯片装置上的每一存储区域写上一组特别的原始数据,然后再将这些数据读取回来,与原始数据相比较,确定是否有错误,最后把结果显示出来。高分子倒装芯片装配的“成功”或“失败”的判断方法就这样得以建立。PFC工艺装配得到的智能卡模块可以达到以上耐受环境和电气可靠性的全部要求。在智能卡的制造历史上,高分子倒装芯片工艺是被第一次成功地使用,使用这种技术在芯片的连接垫片和基板连接点之间创建的导电连接能经受所有的可靠性测试。PFC技术虽为新生事物,但是已经被证明它在智能卡模块的装配上是低成本和高可靠性兼备的疏遇难求的通途。
Polymer flip-chip (PFC) processes have been published as a new, more economical, and more advanced method of chip assembly and some applications. In addition, flip-chip mounting techniques for smart cards and PCMCIA cards have also been disclosed. The focus of this article is on smart card / IC microelectronics modules assembled using EPOTEK’s high-molecular-weight flip-chip technology to withstand the heat and environmental sharpening reliability. . The selected test samples are all 4K Series EPROM devices that are assembled and tested according to the requirements and standards of ISO7816-1, 2 or ISO7810. Reliability test items include: -35C / 24 hours of low temperature storage, 125C / 48 hours of high temperature storage, -30C to 70C hot and cold cycles 10 times, 85C / 85% RH constant temperature / humidity storage 96 hours; test items also include : 96 hours salt spray environmental storage and ESD sensitivity test (MS3015-4KV). The final test is 135C baking 1000 hours after the performance data retention. A smart card reader is built into the personal computer interface to run a diagnostic software program. A reusable card holder is used to temporarily secure those assembled memory chip modules during a diagnostic test. This software program is designed to write a unique set of unique raw data for each memory area on the chip device and then read the data back to compare with the original data to determine if there is an error and finally display the result come out. Polymer flip chip assembly “success” or “failure” of the judgment method was established. The smart card module assembled with the PFC process meets all of the above requirements for environmental and electrical reliability. For the first time in the history of smart card manufacturing, the polymer flip-chip process was used successfully. The conductive connections created between the chip’s connection pads and the board connection points using this technology can withstand all reliability tests. Although PFC technology is a newcomer, it has proven to be a difficult and cost-effective way to assemble smart card modules with low cost and high reliability.