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通过直接敷铜(DBC)工艺,在AlN陶瓷基板表面于1 000~1 060℃的敷接温度下制备Cu/AlN材料,利用机械剥离机、场发射扫描电子显微镜和X射线衍射仪分析了Cu/AlN的界面结合强度、界面微观形貌和物相组成。结果表明:铜箔和AlN陶瓷基板间的结合强度超过了8.00N·mm~(-1),铜箔和AlN陶瓷之间存在厚度约为2μm的过渡层,过渡层中主要含有Al_2O_3、CuAlO_2和Cu_2O化合物;随着敷接温度升高,Cu/AlN的界面结合强度逐渐增大。
The Cu / AlN material was prepared by direct copper deposition (DBC) process on the surface of AlN ceramic substrate at the bonding temperature of 1000 ~ 1060 ℃. The Cu / AlN materials were analyzed by mechanical stripping machine, field emission scanning electron microscope and X-ray diffractometer. / AlN interface bonding strength, interface microstructure and phase composition. The results show that the bonding strength between the copper foil and the AlN ceramic substrate exceeds 8.00N · mm -1 and there is a transition layer with a thickness of about 2μm between the copper foil and the AlN ceramic. The transition layer mainly contains Al_2O_3, CuAlO_2 and Cu_2O compound. With the increase of the bonding temperature, the bonding strength of Cu / AlN interface gradually increases.