片上系统(SoC)指的是利用多方面知识产权将复杂的系统或子系统集成到一个硅芯片上,从而提高系统性能,降低系统每项功能成本,并且可在低成本系统中提供高端功能,减少芯片面积。TI 首席战略科学家 Gene A.Frantz 于日前访华行程中阐述了 TI 对于 SoC 发展趋势的看法。Gene A.Frantz 指出,SoC 面临着一些挑战。在开发环境方面,SoC 必须允许设计人员进行假设分析、开发、模拟、仿真、测试与原型设计,在软件方面需要保持产品的个性和功能。复杂的工艺要求使 SoC 产业化面临挑战,在设计和制造加工阶段投入常常达到数百万美元,样品生产则会花费数月时间。对于 SoC 产业化的实现,Gene A.Frantz 认为,业界应该开阔思路,对于适用于特定市场的 SoC,生产商需要取消若干 IC 设计,减少材料清单,同时缩减制造成本和上市时间。TI 把电子系统分为五大构成部分:制造、硬件组件、操作系统、专用软件以及开发环境。其中每个构成部分都对 System on Chip (SoC) refers to the use of multiple intellectual property rights to complex systems or subsystems integrated into a silicon chip, thereby improving system performance, reducing system cost per function, and can provide high-end features in low-cost systems, Reduce the chip area. Gene A. Frantz, chief strategic scientist at TI, elaborated TI’s view on the development trend of SoC in his recent trip to China. Gene A. Frantz pointed out that SoCs face some challenges. In the development environment, SoCs must allow designers to perform what-if analysis, development, simulation, simulation, testing and prototyping, and to maintain the personality and functionality of the product in terms of software. Complex process requirements put SoC industrialization at a challenge, often costing millions in design and manufacturing processes, and months in sample production. For SoC industrialization, Gene A. Frantz believes the industry should broaden its thinking and for SoCs that target specific markets, manufacturers need to eliminate several IC designs, reduce bill of materials, and reduce manufacturing costs and time-to-market. TI divides electronic systems into five major components: manufacturing, hardware components, operating systems, specialized software, and development environments. Each of these components is right