在集成电路封装中,管壳的外引线强度对电路的可靠性往往影响很大。由于生产过程中无法预先进行筛选,事后的检验只能通过抽样对其进行破坏性检测。(如图1)因此,为了提高电路的可靠性,企图通过挑选来获得引线强度一致的产品这是十分困难的。实际上,引线强度低的往往是在电路芯片装架、密封、测试或可靠性试验等后工序中才大量地反映出来,这就大大地影响了整个电路的可靠性。 In integrated circuit packages, the outer lead strength of the package tends to have a significant impact on the reliability of the circuit. Due to the inability to pre-screen during the manufacturing process, subsequent tests can only be destructively tested by sampling. (Figure 1) Therefore, in order to improve the reliability of the circuit, the attempt to obtain the same lead strength through the selection of the product which is very difficult. In fact, the low lead strength is often reflected in a large number of processes such as circuit chip mounting, sealing, testing or reliability testing, which greatly affects the reliability of the entire circuit.