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采用将电弧离子镀与磁控溅射离子镀相结合而得的复合离子镀的方法,分别用高纯Cr作为电弧靶、用高纯Al作为溅射靶,通入氮气和氩气,在高速钢和硅片上沉积(Cr,Al)N薄膜。通过台阶仪、扫描电镜、X射线衍射仪、维氏硬度计等分析和测量手段,研究了不同脉冲偏压占空比条件下(Cr,Al)N薄膜结构和力学性能的变化规律。研究表明,占空比对薄膜的结构和力学性能均有影响,当占空比为40%时,薄膜的沉积速率最大,为12.8 nm/min,用25 g载荷保荷10 s测试的维氏硬度1725 Hv也为实验获得的最大值。
Using a combination of arc ion plating and magnetron sputtering ion plating composite ion plating method, respectively, with high purity Cr as an arc target, with high purity Al as a sputtering target, the introduction of nitrogen and argon, at high speed Deposition of (Cr, Al) N thin films on steel and silicon. The structure and mechanical properties of (Cr, Al) N thin films under different pulse bias duty cycles were studied by means of analysis and measurement of stepper, scanning electron microscopy, X-ray diffraction and Vickers hardness tester. The results show that the duty ratio affects the structure and mechanical properties of the films. When the duty ratio is 40%, the deposition rate of the films is the largest, at 12.8 nm / min. Vickers The hardness of 1725 Hv is also the experimentally obtained maximum value.