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本文描述了IBM公司在管理、改善某些最新的FET半导体产品的成品率方面所发展起来的方法。自从半导体分立元件生产以来,已逐渐研究出大量目视检查和电监控技术。人们已将这些技术所取得的数据用于成品率模型以便得出各成品率因素的相对成品率。这些结果不仅已用于制造线的日常控制,而且还用于今后集成电路产品的规划中。文章举例比较了64KRAM芯片的实际成品率和计划成品率与时间的关系。结果表明:采用冗余电路和有限功能产品使成品率得以提高。另一个例子表明,十多年来失效率也得到降低。
This article describes IBM's approach to managing and improving the yield of some of the latest FET semiconductor products. Since the production of discrete components, semiconductor has been gradually developed a large number of visual inspection and electrical monitoring technology. The data obtained by these technologies have been used in the yield model to arrive at the relative yield of each yield factor. These results have been used not only for routine control of manufacturing lines, but also for future planning of integrated circuit products. The article compares the actual yield of 64KRAM chips and the relationship between planned yield and time. The results show that: the use of redundant circuits and limited functionality products to improve yield. Another example shows that the failure rate has also been reduced for more than a decade.