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在真空度为0.1Pa、加热速率为23℃/min、加热温度为575℃条件下,使用Ag57.6-Cu22.4-In10-Sn10钎料,采用不同保温时间对高体积分数SiC颗粒增强铝基复合材料进行真空钎焊。通过焊接接头抗剪切强度试验、焊缝及焊缝两侧硬度测定以及焊缝显微组织金相观察来分析焊缝的性能,分析保温时间对焊缝质量的影响。试验结果显示,经过钎焊过程,试样的硬度普遍增强,焊缝的硬度大于焊缝两侧母材的硬度,保温时间为5min时,焊缝硬度最大。保温时间3 min,焊缝中存在缺陷,焊接接头性能差。超过5 min,接头的综合性能下降。
Under the conditions of vacuum degree of 0.1 Pa, heating rate of 23 ℃ / min and heating temperature of 575 ℃, Ag57.6-Cu22.4-In10-Sn10 solder was used to treat SiC particles with high volume fraction Base composite vacuum brazing. The weld joint performance was analyzed by the shear strength test of welded joints, the hardness measurement of both sides of weld and weld and the metallographic observation of weld microstructure. The influence of holding time on weld quality was analyzed. The test results show that after the brazing process, the hardness of the sample is generally enhanced, and the hardness of the weld is greater than the hardness of the base metal on both sides of the weld. When the holding time is 5 min, the hardness of the weld is the maximum. Holding time 3 min, weld defects, poor performance of welded joints. Over 5 min, the overall performance of the connector is reduced.