电子设备的高性能化、多功能化,特别是信号传输的高频化和高速化,对信号传输的质量要求越来越高,要求信号传输速度尽量快、信号传输损失尽量小。与信号传输有关的挠性印制电路板,被要求具有更低的介电常数和更低的介电损耗角正切。本文介绍了近年来应用于高频高速领域的挠性覆铜板、覆盖膜及胶膜等挠性印制电路基材的研究进展。 High-performance electronic equipment, multi-functional, especially the high-frequency signal transmission and high-speed, higher and higher requirements on the quality of signal transmission, signal transmission speed as fast as possible, signal transmission losses as small as possible. Flexible printed circuit boards associated with signal transmission are required to have lower dielectric constant and lower dielectric loss tangent. In this paper, the research progress of flexible printed circuit substrates, such as flexible CCL, cover film and plastic film, applied in the high frequency and high speed fields in recent years is introduced.