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本文主要讨论全高度(海平面至20km高空)电子设备用冷板设计。介绍了冷板常用肋片结构和技术数据,无相变工况下冷板传热表面的传热和流体阻力设计,着重展示了空气冷却式冷板在20km高空及以下随高度变化的部分性能影响因素与相关设计计算过程,并进行了编程实现。
This article focuses on the full height (sea level to 20km altitude) electronic equipment with cold plate design. The common fin structure and technical data of cold plate are introduced. The heat transfer and fluid resistance design of cold plate heat transfer surface without phase change condition are emphasized. Some performances of the air cooled cold plate at height of 20 km and below are highlighted Influencing factors and related design calculation process, and carried out programming.