近日,无线基础设施半导体领域的全球销售领先者杰尔系统,推出五款高性能的射频超模压塑封装晶体管,将使封装成本下降高达25%。杰尔的解决方案不仅能够降低基站的整体成本,而且还可加快无线基站放大器设备的大规模部署。这些塑料封装的晶体管将用于无线基站放大 Recently, Agere Systems, the global leader in the field of wireless infrastructure semiconductors, introduced five high-performance RF overmolded transistors that will reduce packaging costs by up to 25%. Agere’s solution not only reduces the overall cost of a base station, but it also speeds the large-scale deployment of wireless base station amplifier equipment. These plastic encapsulated transistors will be used for wireless base station amplification