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采用有限元方法对SiCp/Al复合材料制备冷却后的热残余应力进行了数值模拟,建立平面应力单颗粒及多颗粒复合材料几何模型,研究了颗粒形貌及体积分数对复合材料热残余应力的影响。结果表明,复合材料中颗粒和基体的界面附近存在较大的热残余应力,球形颗粒模型热残余应力比方形颗粒模型热残余应力小,多颗粒模型中应力分布较复杂,复合材料热残余应力随颗粒体积分数增加而增大。
The thermal residual stress of SiCp / Al composites after cooling was numerically simulated by finite element method. The geometrical model of plane stress single particles and multipartite composites was established. The effects of particle morphology and volume fraction on thermal residual stress influences. The results show that there is a large thermal residual stress near the interface between the particles and the matrix in the composite. The thermal residual stress of the spherical particle model is smaller than the thermal residual stress of the square particle model. The stress distribution in the multi-particle model is complex. The thermal residual stress Particle volume fraction increased and increased.