在硅片切割工序中采用了一种新的退线方法,硅片切割完成后和提升硅片前增加一道退线工序,用于清除导轮上的线网,有效地减少硅片粘接面和侧面的崩缺和隐裂,减少掉片的产生;采用导轮和绕线轮反转的方法收取线网,减少一道用剪刀剪除导轮上线网的工序,消除了因碎钢线引起的误报警停机和硅片相应位置的停机线痕。 In the silicon wafer cutting process used in a new line of withdrawal method, after the silicon wafer cutting and lifting the silicon before adding an offline process, used to clear the wire on the guide wheel, effectively reducing the silicon bonding surface And the side of the collapse and the crack, to reduce the film produced; the use of guide wheels and winding wheel reversal method of collecting the net, reducing the use of a scissors to remove the guide wheel on the net process, eliminating the broken steel wire caused False alarm Shutdown and the corresponding position of the silicon line stop marks.