据《Solidstate Technology》2003年第3期报道,美国北卡州三角研发园区的Ziptronix公司新开发了不同半导体界面材料的键合技术,将微机电系统(MEMS)和声表器件(SAW)进行全晶圆级的封装。这一工艺技术进行各种灵活且低成本的设计,并使MEMS与IC技术匹配,而无需复杂的结构、测试和组装,这一工艺技术约占MEMS元件成本的 According to Solidstate Technology, Issue 3, 2003, Ziptronix Inc., a research and development park in the Triangle, North Carolina, USA, has developed new bonding technologies for different semiconductor interface materials, including MEMS and SAW Wafer-level package. This process technology offers a variety of flexible and cost-effective designs that match MEMS with IC technology without the need for complex structures, testing, and assembly, a process technology that accounts for the cost of MEMS components