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针对光学材料磨削加工引入的亚表面损伤层,综合使用磁流变抛光斑点技术和HF差动化学蚀刻速率法测量亚表面裂纹层深度和亚表面残余应力层厚度。建立了亚表面裂纹层深度与表面粗糙度间关系的理论模型,以实现亚表面裂纹层深度的准确预测,并通过分析亚表面裂纹尖端应力场,预测了亚表面裂纹尖端塑性层厚度。
Aiming at the subsurface damage layer introduced by optical material grinding, the sub-surface crack depth and sub-surface residual stress layer thickness were measured by using the combination of magneto-rheological polishing spot and HF differential chemical etching rate method. The theoretical model of the relationship between sub-surface crack depth and surface roughness was established to predict the sub-surface crack depth accurately. The sub-surface crack tip plasticity thickness was predicted by analyzing the stress field at the sub-surface crack tip.