导电粒子掺入到绝缘体中会显著提高其介电常数，理论上这种增强超出了Ｃ－Ｍ方程和其它偶极近似的结果。近来有人［１］引入一种有效集结模型来描述这种增长规律，其中对于非球形导电粒子的影响引入一个形状因子ｕ０来描述，但他们都是把绝缘体作为基体来处理。本文的目的在于采用对等来处理这种介质，像文献［２］一样来修正Ｄ－Ｊ方程，同时与铜、铝微粒掺入聚乙烯中的实验规律进行了比较，微观分析了微粒的形貌和分布，得到与理论相符合的结果 The incorporation of conductive particles into the insulator significantly increases the dielectric constant, which theoretically goes beyond the C-M equation and other dipole approximations. Recently, [1] introduced an effective assembly model to describe this growth law, in which the effect of non-spherical conductive particles is introduced by a form factor u0, but they all treat the insulator as a matrix. The purpose of this paper is to deal with this medium by using the equivalence method. The D-J equation is modified like the one in [2], and the experimental rules are compared with the incorporation of copper and aluminum particles into polyethylene. Appearance and distribution, get the result that is consistent with the theory