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美国国家半导体公司的主要圆片制造工艺的早期失效率（PPM）和长期失效率（FIT）如表1所示。早期失效率是以X2分布、60％置信度来计算的。长期失效率则以阿列尼斯（Arrhenius）公式、激活能为0.7eV、应力温度降到55℃应用温度时、60％置信度计算出来的。
The early failure rate (PPM) and long-term failure rate (FIT) of the major wafer manufacturing processes of National Semiconductor Corporation are shown in Table 1. The early failure rate is calculated with X2 distribution and 60% confidence. The long-term failure rate is calculated with Arrhenius formula, activation energy of 0.7 eV, and stress temperature drop to 55°C application temperature with 60% confidence.