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本文介绍了基于超微磨粒电泳效应的磨削加工机理，着重分析不同材料特性的磨具对电泳磨削效果的影响。通过对半导体硅片的电泳磨削试验，表明弹性模量小的磨具能更有效地降低工件表面粗糙度。
In this paper, the grinding mechanism based on the effect of ultrafine abrasive particles is introduced, and the effect of abrasive with different materials on the grinding effect of electrophoresis is analyzed. Through the electrophoretic grinding test of semiconductor wafer, it shows that the abrasive with small elastic modulus can reduce the surface roughness more effectively.